TISTM680-15AB 1.5w/Mk Thermal Potting Compound Silicone Thermal Conductive Resin Potting Compound AB Glue
TIS™680-15AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silicaencapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make themsuited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from theseparate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generatingelectronic components.
Feature
>Good thermal conductive: 1.5W/mK
>Excellent insulation and smoothly sourface.
>Low shrinkage
>Low viscosity, expediting air releaseed.
>Excellent in solvents and water proof.
>Longer life time.
>Excellent thermal shock efficiecy andimpact resistance
Application
>To potting LED Lighting heat spreader andpower- driver.
>Ferrite cements; tip type LED; good cementation toaromatic polyester
>Relay sealant; Good adhesion to rubber, ceramics,PCB and plastics
>Power transformers and coils; Potting capacitors;Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coating and sealant;Coil ; IGBTS; Transformer; Fire retardant
>Optical / medical component adhesive
| Typical Properties of TISTM 680-15AB Series |
| Material Properties(before Curing) |
| |
TIS680-15A |
TIS680-15B |
| Color |
White |
Gray |
| Viscosity @25℃(mPa.s) |
4000±1000 cPS |
4000±1000 cPS |
| Specific Gravity |
2.3g/cc |
| Shelf life |
6 months @25℃ in sealed container |
| |
| Mixing Ratio (By weight) |
TISTM680-15A : TISTM680-15B = 100 :100 |
| Working pot life ( 250g @25℃) |
30 mins |
| Conditions for Complete Curing |
@25℃ 3Hours |
| @70℃ 20min |
| Material Properties(After Curing) |
| Hardness @25℃ (Shore D) |
85 |
| Operating temperature (℃) |
-40 ~160 |
| Glass transition temperature Tg |
92℃ |
| Elongation(%) |
4.5 |
| CLTE (1/℃) |
3.0x 10-5 |
| Fire resistance UL |
94 V-0 |
Moisture absorption % wt gain 24 hours
waterimmersion @25℃ |
< 0.1 |
| Thermal Conductivity (W/mK) |
1.5 |
| Thermal Impedance @10psi (℃-in²/W) |
0.36 |
| Dielectric Constant@1MHz |
4.2 |
| Dissipation factor @1 MHz |
0.029 |
| volume resistivity, ohm-cm @ 25℃ |
3.0x 1013 |
Package:
300ml/Tube, 24PCS/Box
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIS680-15AB 1.5w/Mk Thermal Potting Compound Silicone Thermal Conductive Resin Potting Compound AB Glue Images
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