TIE280-15AB Two-Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board
Product Summary:
TIE™ 280-15AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency andlife-time of the heat-generating electronic components.
Features
>Good thermal conductive: 1.5W/mK
> Excellent insulation and smoothlysourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy andimpact resistance
Application
>To potting LED Lighting heat spreaderand power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester
>Relay sealant; Good adhesion torubber, ceramics,PCB and plastics
>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coatingand sealant; Coil ; lGBTS;Transformer; Fire retardant
>Optical / medical component adhesive
| Typical Properties of TIE280-15AB Series |
| Typical Uncured Material |
| TIETM280-15A(Resin) | Mixing ratio (weight ratio)
A:=1 :1 |
| Color | Black |
| Viscosity @25℃ Brookfield | 15000 cPs | Viscosity @25℃ Brookfield | 10000 cPs |
| Operating time (@25℃) | 45 mins |
| Shelf life @25℃ in sealed | 12 months | specific Gravity | 1.6 g/cc |
| Mixture Color | Black |
| TIETM280-12B(Hardener) | Cure Schedule |
| Color | Black | Cure at 25C | 3 hrs |
| Viscosity @25℃ Brookfield | 7000 cPs |
| Shelf life @25℃ in sealed container | 12 months | Cure at 7o°c | 30 mins |
| Cured Properties |
| Hardness @25℃ | 85 Shore D |
| Operating temperature | -40℃ ~160℃ |
| Glass transition temperature Tg | 92℃ |
| Rate of tension | 0.10% |
| Coefficient of thermal expansion, /℃ | 3.0x 10-5 |
| Fire resistance uL | 94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | <0.1% |
| Thermal Conductivity | 1.5 W/m-K |
| Dielectric Breakdown Voltage | 300 volts / mil |
| Dielectric Constant@1MHz | 4.2 |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 1013 |
Product packaging
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
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TIE280-15AB Two-Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board Images
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