TIF100-50-05S Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions
Product descriptions
TlF100-50-05S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
Features
> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
| Typical Properties of TIF100-50-05S Series |
| Property | Value | Test method |
| Color | Blue | ***** |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.15g/cc | ASTM D297 |
| Thickness range | 0.020"(0.50mm)~0.200"(5.0mm) | ASTM D374 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 6.0 MHz | ASTM D150 |
| Volume Resistivity | 5.0X10¹³ Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 5.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
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TIF100-50-05S Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions Images
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